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Premium Large Liquid Glue Remover for Mobile Motherboard & IC Cleaning

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2.00JD

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  2.00JD

Detail Description

  1. Large-Capacity Glue Remover: Professional liquid cleaning solution designed for high-volume smartphone motherboard, IC, and electronics repair.
  2. Fast-Acting Formula: Helps penetrate and soften stubborn adhesive residues for easier controlled cleaning and scraping.
  3. Black Glue Removal: Suitable for loosening black adhesive and Underfill residue surrounding ICs during advanced board-level repair.
  4. OCA Residue Cleaning: Helps remove OCA adhesive residue during display refurbishment and precision electronics servicing.
  5. UV Mask Cleaning: Suitable for controlled cleaning and removal of compatible UV Mask residues during PCB repair.
  6. IC Reballing Preparation: Helps clean and prepare chip and motherboard surfaces before IC Reballing and component-level repair.
  7. Precision PCB Cleaning: Designed for use around PCB circuits, copper traces, IC areas, and other sensitive repair zones when applied correctly.
  8. Large Economical Bottle: Higher-volume packaging is practical for busy repair centers, laboratories, and workshops with frequent daily use.
  9. Efficient Workshop Supply: Large-size format reduces the need for frequent replacement and supports continuous professional repair workflows.
  10. Professional Repair Applications: Suitable for motherboard degumming, IC cleaning, Underfill removal, OCA residue cleaning, BGA preparation, and advanced smartphone repair.


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Premium Large Liquid Glue Remover for Mobile Motherboard & IC Cleaning
2.00JD 0.00JD
2.00JD
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