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MECHANIC GR300 CPU Chip Degumming Liquid

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5.00JD

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  5.00JD

Detail Description

  1. Professional Chip Degumming Liquid: Designed for removing adhesive around CPUs, ICs, and microchips during smartphone motherboard repair.
  2. Black Glue Removal: Helps soften stubborn black glue surrounding chips and sensitive PCB components.
  3. Epoxy Resin Softening: Formulated to penetrate and loosen hardened epoxy and adhesive residue for easier removal.
  4. Fast-Acting Formula: Works within minutes to help prepare adhesive for controlled scraping and cleaning.
  5. CPU & IC Cleaning: Suitable for detailed cleaning around processors, ICs, BGA areas, and other motherboard components.
  6. PCB-Safe Application: Designed for careful use around PCB traces and surrounding electronic components during professional repair.
  7. Chip Desoldering Support: Helps technicians prepare glued chips before controlled removal and desoldering procedures.
  8. IC Reballing Preparation: Useful for cleaning chip surfaces and surrounding areas before reballing and reinstallation.
  9. Precision Motherboard Repair: Suitable for detailed board-level repair where controlled adhesive removal is required.
  10. Professional Repair Use: Ideal for smartphone repair centers, electronics laboratories, and advanced chip-level maintenance.


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MECHANIC GR300 CPU Chip Degumming Liquid
5.00JD 0.00JD
5.00JD
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