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Physical Product

MECHANIC UV-223 High Activity Soldering Flux Paste - Large Size (100g)

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4.00JD

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Detail Description

  1. High-Activity Flux Paste: Professional soldering flux designed for advanced electronics repair, smartphone motherboard servicing, and precision Micro-Soldering.
  2. Large 100g Package: Supplied in a high-capacity 100g container suitable for frequent professional use and busy repair workshops.
  3. Enhanced Thermal Wetting: Helps solder spread efficiently across compatible pads and component contacts during controlled heating.
  4. Strong Capillary Action: Designed to flow into narrow spaces around and beneath densely positioned ICs and miniature electronic components.
  5. BGA IC Reballing: Suitable for detailed BGA and IC Reballing procedures on high-density smartphone Logic Boards.
  6. SMD Component Work: Supports accurate soldering and positioning of miniature SMD components during component-level repair.
  7. Controlled Solder Flow: Flux consistency helps maintain smooth solder movement during Reflow, Reballing, and precision soldering.
  8. Flex Connection Support: Suitable for compatible internal Flex connections and delicate conductive solder points.
  9. High-Density PCB Repair: Designed for detailed work around fine Pads, compact ICs, and closely arranged motherboard components.
  10. Professional Micro-Soldering Use: Ideal for BGA Reballing, IC servicing, SMD repair, Flex work, PCB maintenance, and smartphone motherboard repair.


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MECHANIC UV-223 High Activity Soldering Flux Paste - Large Size (100g)
4.00JD 0.00JD
4.00JD
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