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Physical Product

MECHANIC UFO 02 High-End BGA Steel Reballing Stencil for iPhone 6S/6SP

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3.00JD

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Detail Description

  1. BGA Reballing Stencil: Professional steel stencil designed for chip-level repair and IC Reballing on compatible iPhone 6S and iPhone 6S Plus Logic Boards.
  2. UFO Circular Design: Part of the MECHANIC UFO stencil series, featuring a circular format suitable for precision work under a microscope.
  3. Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain structural stability during controlled soldering and Hot Air Rework.
  4. Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and warping during repeated thermal workflows.
  5. Precision Laser-Cut Apertures: Micro-precision openings support accurate alignment with compatible IC Pads and BGA layouts.
  6. Consistent Solder Paste Release: Calibrated apertures help distribute Solder Paste evenly for controlled solder-ball formation during Reballing.
  7. Reduced Solder Bridging: Precise aperture geometry and controlled paste application help reduce unwanted Solder Bridging when used correctly.
  8. Power IC Repair Support: Suitable for compatible power-management IC Reballing and chip-level motherboard servicing.
  9. Baseband & Audio IC Support: Designed to support compatible Baseband IC, Audio IC, and other BGA component repair workflows.
  10. Professional Micro-Soldering: Ideal for IC Reballing, Solder Paste application, BGA repair, Logic Board maintenance, and precision iPhone motherboard servicing.


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MECHANIC UFO 02 High-End BGA Steel Reballing Stencil for iPhone 6S/6SP
3.00JD 0.00JD
3.00JD
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