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Physical Product

MECHANIC SAM Composite BGA Steel Stencil Set UFO 13-Port for Samsung

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17.00JD

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  17.00JD

Detail Description

  1. 13-Port BGA Stencil Set: Professional composite steel stencil designed to support multiple compatible Samsung motherboard and IC Reballing workflows.
  2. Samsung Repair Applications: Suitable for compatible Samsung smartphone motherboard repair and chip-level Micro-Soldering procedures.
  3. Multi-Position Layout: 13-port configuration provides multiple stencil sections for working with supported BGA and IC layouts from one repair template.
  4. Composite Stencil Design: Integrates multiple repair patterns into a single practical stencil for professional repair-bench use.
  5. Precision Steel Construction: Steel structure supports stable positioning during controlled BGA Reballing and Solder Paste application.
  6. Accurate Aperture Layout: Precision openings help align Solder Paste with compatible IC Pad matrices during Reballing.
  7. Controlled Paste Distribution: Stencil geometry supports consistent Solder Paste placement across supported BGA patterns.
  8. Reduced Solder Bridging: Accurate positioning and controlled paste application help reduce unwanted Solder Bridging when used correctly.
  9. Microscope Repair Support: Suitable for precision IC work, BGA Reballing, and detailed motherboard servicing under a microscope.
  10. Professional Repair Use: Designed for trained technicians performing Samsung Logic Board, IC, BGA, and Micro-Soldering repair workflows.


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MECHANIC SAM Composite BGA Steel Stencil Set UFO 13-Port for Samsung
17.00JD 0.00JD
17.00JD
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