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MECHANIC S300 3-in-1 MultiFunctional Disassembling Blade Set

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4.00JD

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  4.00JD

Detail Description

  1. 3-in-1 Blade Set: Includes three differently shaped precision blades designed for advanced smartphone and PCB repair applications.
  2. IC Disassembly Support: Suitable for controlled separation and removal work around ICs, chipsets, and densely arranged motherboard components.
  3. Underfill Glue Scraping: Helps scrape hardened black Underfill, resin, and structural adhesive around chips and PCB repair areas.
  4. CPU Layer Separation: Specialized thin blade profiles support detailed CPU and multi-layer chip separation procedures.
  5. Ultra-Thin Flexible Blades: Thin and flexible construction allows technicians to access narrow gaps beneath components and adhesive layers.
  6. Carbon-Alloy Steel: Blades are manufactured from durable carbon-alloy steel for strength, flexibility, and reliable workshop use.
  7. Heat-Treated Construction: Refined thermal treatment improves blade durability and resistance to deformation during demanding repair tasks.
  8. Heat-Resistant Performance: Designed to maintain practical performance during repair procedures involving controlled hot-air exposure.
  9. Precision Blade Edges: Micro-finished edges provide accurate scraping, separation, and lifting around sensitive PCB areas when used carefully.
  10. Anti-Slip Metal Handle: Heavy-duty metal chuck handle provides secure blade locking, balanced handling, and improved control during precision repair.


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MECHANIC S300 3-in-1 MultiFunctional Disassembling Blade Set
4.00JD 0.00JD
4.00JD
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