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Physical Product

MECHANIC Mid-Level Steel Reballing Stencil for iPhone 14 / 14 Plus

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3.00JD

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  3.00JD

Detail Description

  1. iPhone 14 Reballing Stencil: Professional steel stencil designed for motherboard maintenance and IC Reballing on iPhone 14 and iPhone 14 Plus.
  2. Heat-Resistant Stainless Steel: Manufactured from durable stainless steel designed to remain stable during controlled soldering and Hot Air Rework.
  3. Anti-Bulging Structure: Reinforced construction helps reduce stencil deformation and lifting during repeated heating cycles.
  4. Laser-Cut Precision: High-definition laser cutting provides accurately formed openings for detailed motherboard and chip-level repair.
  5. Square Aperture Design: Micro-precise square openings support smooth and consistent Solder Paste release during Reballing.
  6. Accurate Pad Alignment: Precision stencil layout supports reliable positioning over compatible IC Pads and motherboard contact points.
  7. Controlled Paste Application: Consistent aperture geometry helps technicians apply Solder Paste more evenly across dense component layouts.
  8. Reduced Bridging Risk: Precise alignment and controlled paste release help reduce unwanted Solder Bridging during Reballing when used correctly.
  9. Chip-Level Repair Support: Suitable for IC Reballing, motherboard servicing, Micro-Soldering, and other compatible chip-level repair procedures.
  10. Professional Workshop Use: Built for repeated use in smartphone repair and motherboard refurbishment workflows.


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MECHANIC Mid-Level Steel Reballing Stencil for iPhone 14 / 14 Plus
3.00JD 0.00JD
3.00JD
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