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MECHANIC iTin22 High-End BGA Steel Reballing Stencil for iPhone 11 Pro / 11 Pro Max Motherboard

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4.00JD

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  4.00JD

Detail Description

  1. iPhone 11 Pro Series BGA Stencil: Professional steel stencil designed for middle-layer and IC Reballing workflows on compatible iPhone 11 Pro and iPhone 11 Pro Max Logic Boards.
  2. Double-Stacked Logic Board Support: Designed for compatible multi-layer motherboard structures requiring accurate middle-layer alignment and bonding.
  3. Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain stability during controlled Reflow and Hot Air Rework.
  4. Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
  5. Micro-Square Apertures: Precisely calibrated square openings are designed around compatible middle-layer frame and peripheral Pad layouts.
  6. Precision Laser-Cut Design: Fine laser-cut apertures support accurate positioning and controlled Solder Paste application.
  7. Uniform Solder Paste Distribution: Aperture geometry helps distribute Solder Paste evenly across dense connection arrays during Reballing.
  8. Reduced Micro-Bridging: Accurate stencil alignment and controlled paste application help reduce unwanted Solder Bridging when used correctly.
  9. Missing Pad Repair Support: Suitable for compatible Micro-Soldering workflows involving damaged or missing Pad matrices under microscope inspection.
  10. Professional Logic Board Repair: Ideal for middle-layer bonding, BGA Reballing, Solder Paste application, Pad restoration support, and advanced iPhone motherboard servicing.


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MECHANIC iTin22 High-End BGA Steel Reballing Stencil for iPhone 11 Pro / 11 Pro Max Motherboard
4.00JD 0.00JD
4.00JD
4