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MECHANIC iTin 171-IP 13 Pro MAX High-End Middle Layer BGA Steel Reballing Stencil

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5.00JD

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Detail Description

  1. iPhone 13 Pro Max BGA Stencil: Professional middle-layer steel stencil designed for Reballing and Logic Board repair workflows on compatible iPhone 13 Pro Max motherboards.
  2. Dedicated Pro Max Layout: Designed around the specific middle-layer frame and peripheral Pad arrangement of compatible iPhone 13 Pro Max Logic Boards.
  3. Double-Stacked Logic Board Support: Supports accurate middle-layer alignment and controlled bonding procedures on compatible multi-layer motherboard structures.
  4. Heat-Resistant Steel: Manufactured from high-grade steel designed to maintain stability during controlled Reflow and Hot Air Rework.
  5. Anti-Deformation Structure: Reinforced construction helps reduce stencil bending, bulging, and distortion during repeated thermal procedures.
  6. Micro-Square Apertures: Precisely calibrated square openings support accurate alignment with compatible middle-layer and peripheral Pad arrays.
  7. Precision Laser-Cut Design: Fine laser-cut apertures support controlled positioning and consistent Solder Paste application.
  8. Uniform Solder Paste Distribution: Aperture geometry helps distribute Solder Paste evenly across dense motherboard connection arrays.
  9. Reduced Micro-Bridging: Accurate stencil alignment and controlled paste application help reduce unwanted Solder Bridging during Reballing when used correctly.
  10. Professional Logic Board Repair: Suitable for Middle-Layer Bonding, BGA Reballing, Missing Pad repair support, Solder Paste application, and advanced iPhone motherboard servicing.


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MECHANIC iTin 171-IP 13 Pro MAX High-End Middle Layer BGA Steel Reballing Stencil
5.00JD 0.00JD
5.00JD
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