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MECHANIC iTin-12 High Precision Magnetic Tinning Reballing Platform

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8.00JD

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  8.00JD

Detail Description

  1. Magnetic Reballing Platform: Professional precision platform designed for IC tinning, Reballing, and chip-level smartphone motherboard repair.
  2. Strong Magnetic Adsorption: Magnetic holding system keeps compatible steel stencils flat and firmly positioned during solder paste application and heating.
  3. Improved Stencil Stability: Stable magnetic fixation helps reduce unwanted stencil movement, lifting, and misalignment during detailed Reballing procedures.
  4. Precision Guide Pins: Integrated micro-precision alignment pins support accurate positioning between compatible stencil openings and IC Pads.
  5. Controlled Solder Paste Application: Secure stencil positioning helps promote more consistent paste distribution across fine component layouts.
  6. Heat-Resistant Composite Structure: Synthetic composite construction is designed to tolerate elevated temperatures encountered during soldering and Hot Air Rework.
  7. Thermal Insulation Support: Platform materials help limit unnecessary heat transfer to surrounding working areas during controlled repair procedures.
  8. Reduced Warping Risk: Stable support and heat-resistant construction help reduce deformation of compatible boards and stencils during thermal workflows.
  9. PCB & IC Repair Support: Suitable for chip-level repair, IC Reballing, stencil-based tinning, motherboard servicing, and compatible layered PCB workflows.
  10. Professional Micro-Soldering Use: Ideal for precision IC positioning, solder paste application, Reballing, Hot Air work, and advanced smartphone Logic Board repair.


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MECHANIC iTin-12 High Precision Magnetic Tinning Reballing Platform
8.00JD 0.00JD
8.00JD
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