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MECHANIC IP16 Series Heating Module Platform with 2pcs Reballing Steel Stencils

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12.00JD

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Detail Description

  1. iPhone 16 Series Heating Platform: Professional motherboard heating module designed for controlled layer separation, thermal splitting, and BGA Rework on compatible iPhone 16 series Logic Boards through iPhone 16 Pro Max.
  2. Double-Stacked PCB Support: Designed for compatible multi-layer Logic Boards requiring controlled heating during separation, alignment, bonding, and rebuilding procedures.
  3. Uniform Heat Distribution: High-density thermal core architecture helps distribute heat evenly across the working area and reduce concentrated thermal stress.
  4. Controlled Layer Separation: Supports precise thermal splitting while helping reduce unwanted PCB warping when proper repair techniques are followed.
  5. 2 Reballing Steel Stencils: Includes two dedicated high-temperature-resistant steel stencils for compatible BGA Reballing and motherboard repair applications.
  6. Precision Stencil Alignment: Accurately machined stencil layouts support controlled positioning over compatible motherboard Pad arrays under a microscope.
  7. Stable Component Positioning: Platform and stencil structure help reduce unwanted component movement during Solder Paste application, alignment, and controlled thermal Rework.
  8. Heat-Resistant Steel Construction: Steel stencils are designed to maintain dimensional stability during repeated Reflow and BGA repair procedures.
  9. Integrated Cooling Structure: Cooling layout supports controlled heat dissipation following thermal repair procedures.
  10. Professional Logic Board Repair: Suitable for Middle-Layer Separation, BGA Reballing, Solder Paste application, Pad repair support, and advanced multi-layer iPhone motherboard servicing.


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MECHANIC IP16 Series Heating Module Platform with 2pcs Reballing Steel Stencils
12.00JD 0.00JD
12.00JD
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