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MECHANIC iBGA 12 Pro 10in1 Automatic Positioning Leak-proof Reballing Platform

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17.00JD

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  17.00JD

Detail Description

  1. 10-in-1 Reballing Platform: Professional multi-zone platform designed for BGA Reballing, Tin Planting, stencil alignment, and precision smartphone chipset repair workflows.
  2. Automatic Magnetic Positioning: Integrated magnetic positioning architecture helps align compatible steel stencils accurately over supported CPU and IC packages.
  3. Stable Chip Positioning: Secure fixture structure helps reduce unwanted processor and stencil movement during Solder Paste application and controlled thermal Rework.
  4. Leak-Proof Boundary Design: Raised boundary structure is designed to help retain Solder Paste within the working area and reduce unwanted paste overflow during printing.
  5. Precision Solder Printing: Supports controlled Solder Paste placement and consistent BGA ball formation on compatible IC and processor layouts.
  6. 10-in-1 Multi-Zone Configuration: Multiple working zones provide broader compatibility for different supported chipset and BGA repair applications.
  7. High-Density Construction: Manufactured from durable composite materials designed to maintain dimensional stability during repeated thermal repair procedures.
  8. Heat-Resistant Structure: Material construction helps limit unwanted thermal expansion and deformation during controlled Reflow and Hot Air Rework.
  9. Reduced Solder Bridging: Accurate stencil alignment and controlled paste distribution help reduce Micro-Bridging and irregular solder deposition when used correctly.
  10. Professional Micro-Soldering: Suitable for CPU and IC Reballing, Tin Planting, Missing Pad repair support, stencil positioning, Solder Paste application, and advanced Logic Board servicing under a microscope.


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MECHANIC iBGA 12 Pro 10in1 Automatic Positioning Leak-proof Reballing Platform
17.00JD 0.00JD
17.00JD
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