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MECHANIC Hanjiang 3D-XS-M Pro 3D BGA Reballing Stencil Set for iPhone X/XS/XS Max

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3.00JD

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  3.00JD

Detail Description

  1. 3D BGA Reballing Stencil Set: Professional stencil set designed for chip-level repair and Reballing workflows on iPhone X, iPhone XS, and iPhone XS Max Logic Boards.
  2. 3D Stepped Groove Design: Three-dimensional recessed structure helps position compatible chips accurately and maintain alignment during detailed Reballing procedures.
  3. Self-Aligning Support: Structured grooves help reduce unwanted component movement while applying Solder Paste and working with controlled heat.
  4. Heat-Resistant Steel: Manufactured from durable steel designed to maintain stability during soldering and Hot Air Rework.
  5. Anti-Bulging Structure: Reinforced stencil construction helps reduce lifting, deformation, and warping during repeated thermal workflows.
  6. Precision Square Apertures: Laser-cut square openings support consistent Solder Paste release and accurate BGA ball formation.
  7. Reduced Solder Bridging: Precise aperture geometry and controlled paste application help reduce unwanted Solder Bridging during Reballing.
  8. Middle-Layer Logic Board Repair: Suitable for compatible double-stacked board separation, alignment, bonding, and restoration procedures.
  9. CPU & NAND Reballing Support: Designed to support precision CPU, NAND, and other compatible IC Reballing workflows under a microscope.
  10. Professional Micro-Soldering: Ideal for BGA Reballing, Solder Paste application, Logic Board servicing, middle-layer repair, CPU/NAND work, and advanced iPhone motherboard maintenance.


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MECHANIC Hanjiang 3D-XS-M Pro 3D BGA Reballing Stencil Set for iPhone X/XS/XS Max
3.00JD 0.00JD
3.00JD
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