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MECHANIC GR300 Premium Desoldering Solder Wick

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2.00JD

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Detail Description

  1. Professional Desoldering Solder Wick: Designed for precision removal of residual solder during smartphone PCB and chip-level repair.
  2. Oxygen-Free Copper Braid: Made from pure oxygen-free copper wires woven into a high-density braided structure for efficient solder absorption.
  3. Fast Solder Absorption: Capillary action helps quickly absorb molten solder from PCB pads and component footprints when used with a heated soldering iron.
  4. Pre-Fluxed RMA Formula: Pre-treated with a non-corrosive, halogen-free RMA flux formula to improve solder flow and desoldering efficiency.
  5. BGA Pad Cleaning: Suitable for removing residual solder from BGA pads, CPU areas, and high-density SMD footprints.
  6. PCB Trace Protection: Designed to clean solder while helping reduce scratching and mechanical damage to delicate copper traces and solder mask surfaces.
  7. Uniform Heat Distribution: Braided copper construction helps distribute heat across the working area during solder removal.
  8. High-Temperature Performance: Suitable for repeated high-temperature desoldering and professional electronics repair work.
  9. Precision Pad Preparation: Ideal for preparing PCB pads before component replacement, reballing, and advanced micro-soldering.


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MECHANIC GR300 Premium Desoldering Solder Wick
2.00JD 0.00JD
2.00JD
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