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MECHANIC Curve Programmable Disassembly Heating Station for Screen & PCB Separation

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60.00JD

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  60.00JD

Detail Description

  1. Programmable Heating Station: Professional disassembly platform designed for curved screen separation, multi-layer PCB splitting, and precision component desoldering.
  2. Thermal Curve Control: Programmable heating profiles allow technicians to manage controlled temperature progression for different repair workflows.
  3. Curved Screen Separation: Suitable for controlled heating during compatible curved display disassembly and screen refurbishment procedures.
  4. Multi-Layer PCB Splitting: Supports thermal separation of compatible double-stacked and multi-layer Logic Boards during advanced motherboard repair.
  5. Uniform Heat Distribution: Heating platform is designed to spread thermal energy evenly across supported work areas, helping reduce concentrated thermal stress.
  6. Real-Time Digital Control: Integrated digital interface supports active monitoring and adjustment during heating and disassembly procedures.
  7. Multiple Heating Modes: Built-in operating profiles support different smartphone repair, screen separation, PCB Rework, and component desoldering tasks.
  8. Thermal Stress Reduction: Controlled heating helps reduce sudden temperature changes that may contribute to display or Logic Board warping.
  9. Precision Rework Support: Stable heating conditions help reduce unnecessary movement and mechanical stress on sensitive Pads, Traces, and nearby Flex components when used correctly.
  10. Professional Hardware Restoration: Ideal for screen separation, PCB splitting, desoldering, thermal Rework, Logic Board servicing, and advanced smartphone disassembly.


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MECHANIC Curve Programmable Disassembly Heating Station for Screen & PCB Separation
60.00JD 0.00JD
60.00JD
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