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Physical Product

MECHANIC CPG90 Beta CPU Solder Paste (50g / 199°C)

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5.00JD

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  5.00JD

Detail Description

  1. Beta CPU Solder Paste: Professional liquid solder paste developed for advanced Android smartphone CPU Reballing and precision component repair.
  2. 50g Professional Package: Supplied in a 50g container suitable for repeated CPU, BGA, and Micro-Soldering applications.
  3. 199°C Melting Point: Specialized high melting profile of 199°C supports controlled soldering and Reballing procedures requiring this temperature range.
  4. Android CPU Reballing: Formulated specifically for compatible Android processor Reballing and chip-level motherboard servicing.
  5. Micro-Component Tin Planting: Suitable for forming solder balls and applying solder to miniature component pads during precision repair.
  6. Strong Alloy Performance: Formulated to support mechanically stable solder connections in processor and BGA repair applications.
  7. Uniform Paste Texture: Consistent formulation supports smooth application through compatible Reballing stencils.
  8. Reduced Clumping: Fine, homogeneous texture helps minimize uneven paste buildup during stencil application.
  9. Reduced Solder Bridging: Controlled application helps reduce unwanted solder bridges between closely spaced pads.
  10. Reliable Solder Ball Formation: Supports bright, consistent, and well-formed solder balls for CPU, BGA, and advanced motherboard repair.


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MECHANIC CPG90 Beta CPU Solder Paste (50g / 199°C)
5.00JD 0.00JD
5.00JD
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