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MECHANIC Aegis iT3-C Middle Layer Heating Module for iPhone 12 mini

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15.00JD

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  15.00JD

Detail Description

  1. Middle Layer Heating Module: Professional thermal module designed for motherboard splitting, desoldering, and double-stacked PCB repair on iPhone 12 mini.
  2. iPhone 12 mini Compatibility: Precision-machined layout designed to match compatible iPhone 12 mini Logic Board contours.
  3. High-Conductivity Copper Structure: Manufactured from a high-density copper alloy to support efficient thermal transfer during controlled motherboard repair.
  4. Uniform Heat Distribution: Designed to spread heat across the supported board area, helping reduce concentrated thermal stress during separation and Rework.
  5. Anti-Oxidation Coating: Protective surface treatment helps reduce oxidation and supports durability during repeated professional use.
  6. Double-Stacked PCB Repair: Suitable for separating and servicing layered smartphone motherboards during advanced Micro-Soldering procedures.
  7. Precision Board Matching: Machined structure follows the supported motherboard profile to improve positioning and thermal contact during repair.
  8. Thermal Stress Control: Stable heat distribution helps reduce unnecessary Logic Board flexing and warping during compatible heating procedures.
  9. Component Protection Support: Targeted thermal contact helps limit excessive localized heat exposure around sensitive IC and component areas when used correctly.
  10. Professional Motherboard Rework: Ideal for middle-layer separation, board splitting, solder Reflow preparation, Logic Board restoration, and microscope-assisted repair.


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MECHANIC Aegis iT3-C Middle Layer Heating Module for iPhone 12 mini
15.00JD 0.00JD
15.00JD
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