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MECHANIC 008 Professional Motherboard IC Chip Degumming Blade Set

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9.00JD

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Detail Description

  1. Professional Degumming Blade Set: Precision repair kit designed for Underfill epoxy removal, black glue scraping, IC servicing, and detailed smartphone motherboard maintenance.
  2. Multiple Specialized Blade Profiles: Includes several micro-thin blades with different geometric shapes for accessing narrow spaces and complex PCB layouts.
  3. High-Flexibility Spring Steel: Blades are manufactured from flexible spring steel to provide controlled movement while maintaining useful structural rigidity.
  4. Underfill Epoxy Removal: Suitable for carefully scraping hardened Underfill and compatible epoxy residue around IC and CPU areas.
  5. Black Glue Scraping: Fine blade profiles support controlled removal of black adhesive around motherboard components.
  6. Slim Anti-Slip Handle: Lightweight handle with a non-slip surface provides improved control during microscope-assisted repair.
  7. Acid-Resistant Construction: Blade material provides resistance to compatible acidic residues and workshop chemicals encountered during electronics servicing.
  8. High Thermal Stability: Designed for controlled use around Hot Air and desoldering environments during advanced motherboard repair.
  9. Tip Deformation Resistance: Spring steel construction helps the blades recover their shape and reduce permanent deformation during appropriate use.
  10. Controlled PCB Repair: Smooth precision edges help reduce unwanted stress on copper pads, PCB coatings, nearby components, and internal flex cables when used correctly.


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MECHANIC 008 Professional Motherboard IC Chip Degumming Blade Set
9.00JD 0.00JD
9.00JD
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